We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Build-up Board.
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Build-up Board - Company Ranking(7 companies in total)

Last Updated: Aggregation Period:Sep 17, 2025〜Oct 14, 2025
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Company Name Featured Products
Product Image, Product Name, Price Range overview Application/Performance example
The build-up method is a technique for manufacturing multilayer printed circuit boards by stacking layers, performing laser drilling, and fo... Printed circuit board component mounting
♢ Compatible with 0.4mm pitch BGA ♢ Compatible with "0201" SMD chips ♢ High-reliability high-frequency materials and multi-layer build-u... - IoT-related devices - Wearable-related devices - Server cards - Small sensing modules - Small wireless modules : * In providing products, ...
Build-up substrates are essential for further miniaturization and thinning of products. This will explain the basic knowledge and benefits. It is widely used in small and lightweight electronic devices.
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  1. Featured Products
    Printed Circuit Board Manufacturing - Build-Up BoardsPrinted Circuit Board Manufacturing - Build-Up Boards
    overview
    The build-up method is a technique for manufacturing multilayer printed circuit boards by stacking layers, performing laser drilling, and fo...
    Application/Performance example
    Printed circuit board component mounting
    "0201" SMD chip compatible 6-layer (2-2-2) build-up substrate"0201" SMD chip compatible 6-layer (2-2-2) build-up substrate
    overview
    ♢ Compatible with 0.4mm pitch BGA ♢ Compatible with "0201" SMD chips ♢ High-reliability high-frequency materials and multi-layer build-u...
    Application/Performance example
    - IoT-related devices - Wearable-related devices - Server cards - Small sensing modules - Small wireless modules : * In providing products, ...
    [Free Materials Available!] Can't Ask Now! Build-Up Substrate[Free Materials Available!] Can't Ask Now! Build-Up Substrate
    overview
    Build-up substrates are essential for further miniaturization and thinning of products. This will explain the basic knowledge and benefits.
    Application/Performance example
    It is widely used in small and lightweight electronic devices.