Build-up Board - Company Ranking(7 companies in total)
Last Updated: Aggregation Period:Sep 17, 2025〜Oct 14, 2025
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Display Company Information
Company Name | Featured Products | ||
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Product Image, Product Name, Price Range | overview | Application/Performance example | |
The build-up method is a technique for manufacturing multilayer printed circuit boards by stacking layers, performing laser drilling, and fo... | Printed circuit board component mounting | ||
♢ Compatible with 0.4mm pitch BGA ♢ Compatible with "0201" SMD chips ♢ High-reliability high-frequency materials and multi-layer build-u... | - IoT-related devices - Wearable-related devices - Server cards - Small sensing modules - Small wireless modules : * In providing products, ... | ||
Build-up substrates are essential for further miniaturization and thinning of products. This will explain the basic knowledge and benefits. | It is widely used in small and lightweight electronic devices. | ||
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- Featured Products
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Printed Circuit Board Manufacturing - Build-Up Boards
- overview
- The build-up method is a technique for manufacturing multilayer printed circuit boards by stacking layers, performing laser drilling, and fo...
- Application/Performance example
- Printed circuit board component mounting
"0201" SMD chip compatible 6-layer (2-2-2) build-up substrate
- overview
- ♢ Compatible with 0.4mm pitch BGA ♢ Compatible with "0201" SMD chips ♢ High-reliability high-frequency materials and multi-layer build-u...
- Application/Performance example
- - IoT-related devices - Wearable-related devices - Server cards - Small sensing modules - Small wireless modules : * In providing products, ...
[Free Materials Available!] Can't Ask Now! Build-Up Substrate
- overview
- Build-up substrates are essential for further miniaturization and thinning of products. This will explain the basic knowledge and benefits.
- Application/Performance example
- It is widely used in small and lightweight electronic devices.
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